STORY-TRÅD·teknik

Co-Packaged Optics (CPO) foundry roadmaps — breaking down TSMC, Intel, Samsung, and GlobalFoundries' approach to next-generation scale-up connectivity

As AI systems outgrow copper interconnects, TSMC, Intel, Samsung Foundry, and GlobalFoundries are pursuing four distinctly different co-packaged optics strategies to bring optical connectivity closer to compute.