STORY-TRÅD·teknik

Researchers turn HBM on its side to tackle AI memory’s heat wall — Korean V-Die and Japanese MOSAIC designs promise higher bandwidth, denser stacks, and cooler future GPUs

Researchers in Korea and Japan have proposed sideways-stacked DRAM designs that could push future AI memory beyond conventional HBM limits by improving cooling, bandwidth, and capacity while reducing reliance on TSV-heavy vertical stacks.